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FEATURES
Excellent thermal resistance
Excellent rigidity, suitable for HDI process
Low water absorption, excellent anti-CAF, high reliability
Halogen free, compatible with lead-free process
APPLICATIONS
Memory Module, Mobile Phone, Computer
Backplane, Card Board
Server
Heavy Copper Product
Automobile Electronics
GENERAL PROPERTIES
Item | Test Condition | Unit | Spec | Typical value | |
Tg | DSC | ℃ | ≧145 | 153 | |
Peel Strength (1oz THE) | 288℃,10S | N/mm | ≧1.05 | 1.19 | |
Thermal stress | 288℃,solder dip | S | >10 | 180s No delamination | |
Flexural Strength | Warp | N/mm2 | ≧415 | 606 | |
Fill | ≧345 | 485 | |||
Flammability | E 24/125 | — | UL94V-0 | V-0 | |
Surface Resistivity | After moisture | MΩ | ≧1.0x104 | 5.21x107 | |
Volume Resistivity | After moisture | MΩ·cm | ≧1.0x106 | 5.10x109 | |
Dielectric Constant（RC50%） | 1 GHZ C 24/23/50 | — | ≦5.4 | 4.1 | |
Loss Tangent (RC50%) | 1 GHZ C 24/23/50 | — | ≦0.035 | 0.014 | |
Arc Resistance | D 48/50+D 0.5/23 | S | ≧60 | 150 | |
Dielectric Breakdown | D 48/50+D 0.5/23 | kV | ≧40 | 57 | |
Moisture Absorption | D 24/23 | % | ≦0.8 | 0.12 | |
Td | Weight Loss 5% | ℃ | ≧325 | 360 | |
CTE in Z-Axis | Alpha 1 | ppm | TMA | ≦60 | 45 |
Alpha 2 | ppm | ≦300 | 225 | ||
50-260℃ | % | ≦4.0 | 2.7 | ||
T288(Unclad) | TMA | Min | ≧5 | >60 | |
u Specimen thickness: 1.0mm
u Specification sheet: IPC-4101E/127,128, is for your reference only.
u Explanation: C: Humidity conditioning
D: Immersion conditioning distilled water.
E: Temperature conditioning